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I am currently pursuing PhD in Mechanical Engineering at the Indian Institute of Technology Bombay. Before this, I have done my master's in the Department of Mechanical and Industrial Engineering at IIT Roorkee, India. My research areas include Ultrasonic Micromachining, Through-Silicon Vias, and Through-Glass Vias (TGV) for 3D interconnect applications in MEMS Packaging, Copper Electrodeposition. My M Tech research area was designing and developing bobbin tools for friction stir welding.
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论文共 13 篇作者统计合作学者相似作者
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IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 7 (2024): 1292-1299
Applied Physics Ano. 12 (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.1090-1093, (2023)
semanticscholar(2015)
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#Papers: 13
#Citation: 76
H-Index: 5
G-Index: 6
Sociability: 3
Diversity: 1
Activity: 3
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