谷歌浏览器插件
订阅小程序
在清言上使用
VIPCreated with Sketch.
研究兴趣

论文共 19 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Large Wafer GaN on Silicon Reconstitution with Gold-to-Gold Thermocompression Bonding
Ankit Kuchhangi,Haoxiang Ren,Krutikesh Sahoo,Subramanian S. Iyer
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1633-1637, (2023)
引用0浏览0EIWOS引用
0
0
Heterogeneous Power Delivery for Large Chiplet-based Systems Using Integrated GaN/Si-Interconnect Fabric with Sub-10 Μm Bond Pitch
Haoxiang Ren,Krutikesh Sahoo, Ziyi Guo, Rishi Pugazhendhi,Zachary Wong, Tianyu Xiang,Timothy S. Fisher,Subramanian S. Iyer
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
引用0浏览0EIWOS引用
0
0
Demonstration of a Power-efficient and Cost-effective Power Delivery Architecture for Heterogeneously Integrated Wafer-scale Systems
Haoxiang Ren,Krutikesh Sahoo, Tianyu Xiang,Guangqi Ouyang,Subramanian S. Iyer
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1614-1621, (2023)
引用0浏览0EIWOS引用
0
0
3D flexible Fan-Out Wafer-Level Packaging for Wearable Devices
Guangqi Ouyang,Takafumi Fukushima,Haoxiang Ren,Subramanian S. Iyer
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.601-605, (2023)
引用0浏览0EIWOS引用
0
0
A High Throughput Two-Stage Die-to-Wafer Thermal Compression Bonding Scheme for Heterogeneous Integration
Krutikesh Sahoo,Haoxiang Ren,Subramanian S. Iyer
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.362-366, (2023)
引用0浏览0EIWOS引用
0
0
Recess Effect Study and Process Optimization of Sub-10 μm Pitch Die-to-wafer Hybrid Bonding
Haoxiang Ren,Yu-Tao Yang,Subramanian S. Iyer
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.149-156, (2022)
引用6浏览0EIWOS引用
6
0
A Study on Warpage and Reflow Profile for Extreme Extension of Mass Reflow Bonding
Jiwon Shin, Kwangbok Woo,Donguk Kwon,Youngja Kim, Youngmin Lee,Dongwoo Kang,Krutikesh Sahoo,Haoxiang Ren, Yu-Pei Huang,Ujash Shah,Yutao Yang, Ankit Kuchhangi,Subramanian S. Iyer
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1158-1162, (2022)
引用1浏览0引用
1
0
TSV-less Power Delivery for Wafer-scale Assemblies and Interposers
Haoxiang Ren,Saptadeep Pal,Guangqi Ouyang,Randall Irwin,Yu-Tao Yang,Subramanian S. Iyer
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.1934-1939, (2022)
引用1浏览0EIWOS引用
1
0
加载更多
作者统计

#Papers: 19

#Citation: 70

H-Index: 4

G-Index: 8

Sociability: 4

Diversity: 1

Activity: 2

  • 合作者
  • 学生
  • 导师
暂无相似学者，你可以通过学者研究领域进行搜索筛选
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn