基本信息
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职业迁徙
个人简介
Hai-Feng Wu received the B.E. and M.E. degrees in electronics from the University of Electronic Science and Technology of China, Chengdu, China, in 2007 and 2010, respectively, and the Ph.D. degree in microelectronics and solid-state electronics from Tianjin University, Tianjin, China, in 2016.
From 2010 to 2011, he was an Engineer with Accelicon Technologies, Inc., Beijing, China, where he was involved in the transistor model building. Since 2016, he has been an Engineer with the Chengdu Ganide Technology, Chengdu, where he is involved in RFIC design. His current research interests include RF transistors modeling and the power amplifier design in monolithic microwave-integrated circuit.
研究兴趣
论文共 88 篇作者统计合作学者相似作者
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2024 IEEE MTT-S International Wireless Symposium (IWS)pp.1-3, (2024)
2024 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (2024): 1-3
INTERNATIONAL JOURNAL OF NUMERICAL MODELLING-ELECTRONIC NETWORKS DEVICES AND FIELDSno. 4 (2024)
2024 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (2024): 1-4
2024 IEEE MTT-S International Wireless Symposium (IWS)pp.1-4, (2024)
International Journal of RF and Microwave Computer-Aided Engineering (2024): 1-11
2024 International Conference on Microwave and Millimeter Wave Technology (ICMMT) (2024): 1-3
2023 International Conference on Microwave and Millimeter Wave Technology (ICMMT)pp.1-3, (2023)
International Journal of Numerical Modelling Electronic Networks Devices and Fieldsno. 2 (2023)
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作者统计
#Papers: 88
#Citation: 319
H-Index: 11
G-Index: 16
Sociability: 5
Diversity: 2
Activity: 16
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