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Research Interests

Papers共 311 篇Author StatisticsCo-AuthorSimilar Experts

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Key Technologies and Design Aspects for Wafer Level Packaging of High Performance Computing Modules
Kai Zoschke,Hermann Oppermann,Michael Schiffer,Ivan Ndip,Karl-Friedrich Becker, Marius Adler, Alexander Gäbler,Uwe Maaß,Gianna Paulin, Walter Kocon
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.433-440, (2024)
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Wafer Level Capping Technology for Vacuum Packaging of Microbolometers
Kai Zoschke,Charles Alix Manier,Hermann Oppermann,Dirk Meier, Nishant Malik,Elahe Zakizade,Marvin Michel,Avisek Roy,Hoang-Vu Nguyen, Thanh-Phuc Nguyen
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1571-1578, (2023)
Cited0Views0EIWOSBibtex
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Fabrication and Characterization of Nanoporous Gold (NPG) Interconnects for Wafer Level Packaging
Lothar Dietrich,Hermann Oppermann,Christina Lopper,Piotr Mackowiak
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.873-882, (2022)
Cited1Views0EIWOSBibtex
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Author Statistics

#Papers: 313

#Citation: 13994

H-Index: 52

G-Index: 108

Sociability: 7

Diversity: 3

Activity: 18

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