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论文共 21 篇作者统计合作学者相似作者
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2024)
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-7, (2023)
MICROELECTRONICS RELIABILITY (2023)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
JOURNAL OF ELECTRONIC PACKAGINGno. 3 (2023)
2023 AEIT International Conference on Electrical and Electronic Technologies for Automotive (AEIT AUTOMOTIVE)pp.1-6, (2023)
2022 14th International Conference on Advanced Semiconductor Devices and Microsystems (ASDAM)pp.1-4, (2022)
Alessandro Sitta,Giuseppe Mauromicale, Giovanni Corrente,Angelo Alberto Messina, Francesco Rundo,Michele Calabretta,Gaetano Sequenzia
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作者统计
#Papers: 21
#Citation: 50
H-Index: 4
G-Index: 6
Sociability: 4
Diversity: 1
Activity: 3
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