Dogiamis, G.C.

Georgios C. Dogiamis (Member, IEEE) received the Dipl.Ing. degree in electrical and computer engineering from the National Technical University of Athens, Athens, Greece, in 2006, the M.Sc. degree in electrical engineering from the California Institute of Technology, Pasadena, CA, USA, in 2009, and the Ph.D. degree in electrical engineering from the University of Duisburg–Essen, Duisburg, Germany, in 2014. He was with the Informatics Department, Hellenic Army General Staff, Athens, from 2007 to 2009. Since 2009, he has been a Staff Researcher with the University of Duisburg–Essen and the Fraunhofer Institute (IMS), Duisburg. He joined the Components Research Team, Intel Corporation, Chandler, AZ, USA, in 2014, where he is currently a Principal Engineer. He holds more than 20 U.S. patents. His current research interests include flexible ultrathin circuits and sensors, millimeter-wave and sub-terahertz (THz) systems, and their associated packaging techniques.