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职业迁徙
个人简介
Gang Wang was born in Shanxi, China, in 1986. He received the bachelor’s and Ph.D. Eng. degrees from the Beijing Institute of Technology, Beijing, China, in 2007 and 2014, respectively.
He was invited as a Visiting Scholar with the LMM Laboratory, Saarland University, Saarbruecken, Germany, during 2011–2012. He was employed as an Assistant Director of the Microsystem Technology Center, CETC, Beijing. In 2019, he joined the 58th Research Institute of China Electronics Technology Group Corporation, Wuxi, China, as a Senior Engineer. His studies focus on MEMS and microsystems and wafer-level packaging. He has authored nine journal and conference papers.
研究兴趣
论文共 10 篇作者统计合作学者相似作者
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期刊级别
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2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.01-05, (2024)
SOLDERING & SURFACE MOUNT TECHNOLOGYno. 2 (2024): 93-100
JOURNAL OF ELECTRONIC PACKAGINGno. 3 (2023)
MICROELECTRONICS INTERNATIONALno. 2 (2023): 104-108
IEEE transactions on components, packaging, and manufacturing technologyno. 8 (2022): 1262-1270
IOP Conference Series Materials Science and Engineeringno. 2 (2020)
ZTE communicationsno. 3 (2020): 33-41
作者统计
#Papers: 10
#Citation: 7
H-Index: 2
G-Index: 2
Sociability: 3
Diversity: 1
Activity: 3
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