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个人简介
working on energy-efficient data converter, power/signal integrity, and 3-D integration technologies, where he is currently the Program Manager in 3-D program addressing system scaling using advanced 3-D through-silicon via (TSV) and packaging fan-out wafer-level packaging (FO-WLP) technology for high-performance, mobile, and the Internet of Things applications. His research interests include characterization, modeling, system exploration, and design enablement of 3-D integration technologies.
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论文共 339 篇作者统计合作学者相似作者
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1072-1077, (2024)
Fluidsno. 3 (2024): 69-69
Melina Lofrano,Herman Oprins,Vladimir Cherman, Lisbeth Witters,Anne Jourdain,Geert Van der Plas,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1036-1043, (2024)
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 99 (2024): 1-1
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1064-1071, (2024)
Microelectronic Engineering (2023): 111947-111947
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-10, (2023)
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antoine Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas,Eric Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
Mohamed Naeim,Hanqi Yang, Pinhong Chen, Rong Bao, Antione Dekeyser,Giuliano Sisto,Moritz Brunion,Rongmei Chen,Geert Van der Plas, Erik Beyne,Dragomir Milojevic
2023 IEEE INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE, 3DIC (2023)
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#Papers: 348
#Citation: 8724
H-Index: 47
G-Index: 79
Sociability: 7
Diversity: 3
Activity: 18
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