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论文共 842 篇作者统计合作学者相似作者

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Methodologies for Characterization of W2W Bonding Strength
Mario Gonzalez,Kris Vanstreels,Oguzhan Orkut Okudur,Serena Iacovo,Eric Beyne
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.790-797, (2024)
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A 32 Gb/s Full Duplex Bi-directional Transceiver with Crosstalk Cancellation for Chiplet Interconnections
Jae-Woo Park,Nicolas Pantano,Geert Van Der Plas,Eric Beyne,Jung-Hoon Chun
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1072-1077, (2024)
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Characterization of Siliconcarbonitride Bonding Layer for Plasma Activated Direct Fusion Bonding
David Doppelbauer, Christoph Floetgen, Ignacio Gabriel Vicente Gabás, Serena Iacovo, Steven Brems,Eric Beyne, Jiri Duchoslav, Heiko Groiss
2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
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Backside Power Delivery with Relaxed Overlay for Backside Patterning Using Extreme Wafer Thinning and Molybdenum-filled Slit Nano Through Silicon Vias
P. Zhao,Liesbeth Witters, Anne Jourdain,Michele Stucchi, Nicolas Jourdan, J. W. Maes, H. Bana, C. Zhu, R. Chukka, F. Sebaai,Kevin Vandersmissen,N. Heylen, D. Montero, S. Wang,K. D'Have,F. Schleicher,J. De Vos, Gerald Beyer, A. Miller,Eric Beyne
IEEE Transactions on Electron Devicespp.1-7, (2024)
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Scatterometry Application on Cu/SiCN Surface Topography Towards High Volume Manufacturing
Soon Aik Chew, Joey Hung,Igor Turovets, Mohamed Saib, Avron Ger,Alain Moussa, Boyao Zhang,Joeri De Vos,Andy Miller,Anne-Laure Charley,Philippe Leray,Eric Beyne
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-5, (2024)
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Simulations of Wafer-to-Wafer Bonding Dynamics and Deformation Mechanisms
Oguzhan Orkut Okudur, Serena Iacovo, Shuo Kang,Mario Gonzalez,Eric Beyne
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-5, (2024)
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作者统计

#Papers: 842

#Citation: 12070

H-Index: 45

G-Index: 77

Sociability: 8

Diversity: 1

Activity: 8

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