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论文共 56 篇作者统计合作学者相似作者

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Electrical Performance of Self-Assembly Applied to Die-to-Wafer Hybrid Bonding
Adèle Thiolon,Pierre Montméat,Thierry Enot,Alice Bond,Carine Ladner,Loic Sanchez,Alain Campo,Thomas Magis, Floriane Baudin, Sébastien Dominguez,Frank Fournel,Emilie Bourjot
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-7, (2024)
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Study and Control of the Distortion Induced by the Bonding Process for BSPDN Approaches
Karine Abadie,Ivanie Mendes,Marie-Line Pourteau,Frank Fournel, Hadi Hijazi,Viorel Balan,Richard van Haren, Suwen Li, Blandine Minghetti,Leon van Dijk, Mart Baars, Laurent Michaud,Thomas Plach,Gernot Probst
2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
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A Nanofluidic Exchanger for Harvesting Saline Gradient Energy
Saranath Sripriya,Cyril Picard,Vincent Larrey,Frank Fournel,Elisabeth Charlaix
Lab on a chipno. 23 (2024): 5193-5202
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Copper Microstructure Optimization for Fine Pitch Low Temperature Cu/SiO2 Hybrid Bonding
Marie Maubert,Mathilde Gottardi,Pierre-Emile Philip, Emilie Fragnaud,Gilles Romero, Arnaud Cornelis, Hadi Hijazi,Frank Fournel, Maria-Luisa Calvo-Munoz
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.631-636, (2024)
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Ultra Low Temperature Hybrid Bonding: Morphological and Electrical Characterizations
Margot Faure,Christophe Dubarry, Pablo Renaud, Floriane Baudin, Sebastien Dominguez,Karine Abadie,Christophe Morales,Constantin Matei,Frank Fournel
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-6, (2024)
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Vacuum Quality Impact on Covalent Bonding
Karine Abadie, Quentin Lomonaco,Laurent Michaud,Frank Fournel,Christophe Morales
ECS Transactionsno. 3 (2023): 125-137
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