按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
LASER APPLICATIONS IN MICROELECTRONIC AND OPTOELECTRONIC MANUFACTURING, LAMOM XXIX (2024)
0
0
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.860-864, (2024)
EIWOS
0
0
ECS Meeting Abstractsno. 25 (2020): 1789-1789
0
0
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2019): 001118-001144
0
0
Smart Systems Integration; 13th International Conference and Exhibition on Integration Issues of Miniaturized Systemspp.1-4, (2019)
EIWOS
0
0
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT)no. DPC (2017): 1-21
0
0
SOLID STATE TECHNOLOGYno. 5 (2017): 12-17
0
0
Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. DPC (2016): 001255-001276
1
0