基本信息
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职业迁徙
个人简介
Denis Guangyin Chen (S’07–M’13) received the B.Eng. (1st Class Hons.) degree in electrical and electronic engineering from the University of Canterbury, Christchurch, New Zealand, and the Ph.D. degree in electronic and computer engineering from the Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong, in 2008 and 2013, respectively.
Currently, he is a Sensing Systems Hardware Engineer at Apple Inc. From 2013 to 2014, he was a Research Associate at the Smart Sensory Integrated System (S2IS) Laboratory at HKUST, where he worked on CMOS image sensors, compressive imaging, low-power SAR ADC with error-correction, biomedical implants, smart infrastructures, and laser Doppler imaging (LDI).
研究兴趣
论文共 40 篇作者统计合作学者相似作者
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Gary Tsai,Denis Chen
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.287-289, (2023)
Dian-Ying Wu,Denis Chen
2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.324-326, (2023)
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
Gary Tsai,Denis Chen
2022 17TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) (2022)
2022 17TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT) (2022)
Shijuan Qin,Patt Chang,Falconee Lee,Thonas Su,Denis Chen, Ariel Guo,Weijie Yuan, Mark Cao, Aje Chang, Donald Fan,Yl Li,Jimmy Hsu,Kevin Liang,Bryant Tsai,Kate Tzeng
2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)pp.1-4, (2022)
2021 16TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT)pp.119-122, (2021)
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作者统计
#Papers: 40
#Citation: 414
H-Index: 11
G-Index: 20
Sociability: 4
Diversity: 2
Activity: 0
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