Research Interests

Papers共 13 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects
Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen,Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann,B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross,Seongho Park, Zsolt Tokei
Symposium on VLSI Technologypp.1-2, (2024)
Cited0Views0EIWOSBibtex
0
0
Exploring the Benefits of Cryogenic Temperatures for Co and Ru Metallizations
Davide Tierno,Ivan Ciofi,Olalla Varela Pedreira,Bertrand Parvais,Kristof Croes
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
Cited0Views0EIWOSBibtex
0
0
ALD Mo for Advanced MOL Local Interconnects
Maryamsadat Hosseini,Davide Tierno,Jan Willem Maes,Chiyu Zhu,Sukanya Datta, Young Byun,Moataz Mousa,Nicolas Jourdan,Eugenio Dentoni Litta,Naoto Horiguchi
2022 IEEE International Interconnect Technology Conference (IITC)pp.145-147, (2022)
Cited3Views0EIWOSBibtex
3
0
Reliability of Barrierless PVD Mo
Davide Tierno,M. Hosseini,M. van der Veen,A. Dangol,K. Croes,S. Demuynck,Z. S. Tokei,E. D. Litta,N. Horiguchi
International Interconnect Technology Conferencepp.1-3, (2021)
Cited5Views0EIWOSBibtex
5
0
Impact of Surface Condition on Cobalt Drift into LK3.0 Films
Davide Tierno,A. Lesniewska,L. Kljucar,M. H. van der Veen,Zs Tokei,K. Croes
2020 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE (IITC)pp.142-144, (2020)
Cited0Views0EIWOSBibtex
0
0
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Author Statistics

#Papers: 13

#Citation: 52

H-Index: 4

G-Index: 7

Sociability: 5

Diversity: 0

Activity: 0

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