基本信息
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Career Trajectory
Bio
Chunlei Shi (Member, IEEE) received the B.S. and M.S. degrees in electrical engineering from Tsinghua University, Beijing, China, in 1994 and 1997, respectively, and the Ph.D. degree in electrical engineering from Ohio State University, Columbus, OH, USA, in 2001.
From 2001 to 2018, he was a Principal Engineer/Manager with Qualcomm Inc., San Diego, CA, USA. From 2018 to 2019, he was a Senior Director with Futurewei USA, San Diego. From 2019 to 2020, he was a Senior Director with Achernar Technologies, San Diego. Since 2020, he has been a Senior Director with Spreadtrum Communications USA, San Diego. He has authored or coauthored over 20 scientific publications and holds 17 U.S. patents with five more pending. His current research interests include RF/analog/mixed-signal/power-management IC design and low-power techniques.
Dr. Shi served as a TPC Member of the IEEE Custom Integrated Circuit Conference from 2014 to 2020.
Research Interests
Papers共 10 篇Author StatisticsCo-AuthorSimilar Experts
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Chunlei Shi, Xiaoping Li
Yu Pu,Chunlei Shi,Giby Samson, Dongkyu Park,Ken Easton,Rudy Beraha,Adam Newham,Mark Lin, Venkat Rangan, Karam Chatha, Danny Butterfield,Rashid Attar
IEEE Journal of Solid-State Circuitsno. 3 (2018): 936-948
Yu Pu,Chunlei Shi,Giby Samson, Dongkyu Park,Ken Easton,Rudy Beraha,Adam Newham,Mark Lin,Venkat Rangan, Karam Chatha, Danny Butterfield,Rashid Attar
Yu Pu, Danny Butterfield, Jorge Garcia,Jing Xie,Mark Lin, Rohit Sauhta, Rick Farley, Steve Shellhammer, Moses Derkalousdian,Adam Newham,Chunlei Shi, Ravi Shenoy, Evgeni Gousev,Rashid Attar
2017 IEEE Symposium in Low-Power and High-Speed Chips (COOL CHIPS)pp.1-3, (2017)
2017 IEEE SOI-3D-Subthreshold Microelectronics Technology Unified Conference (S3S)pp.1-2, (2017)
Author Statistics
#Papers: 10
#Citation: 242
H-Index: 6
G-Index: 8
Sociability: 3
Diversity: 2
Activity: 2
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