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职业迁徙
个人简介
Christian Schuster (Senior Member, IEEE) received the Diploma degree in physics from the University of Konstanz, Konstanz, Germany, in 1996, and the Ph.D. degree in electrical engineering from the Swiss Federal Institute of Technology (ETH), Zurich, Switzerland, in 2000.
From 2006, he is Full Professor and Head of the Institute of Electromagnetic Theory, Hamburg University of Technology (TUHH), Hamburg, Germany. Prior to that, he was with the IBM T. J. Watson Research Center, Yorktown Heights, NY, USA, where he was involved in high-speed optoelectronic package and backplane interconnect modeling and signal integrity design for new server generations. He is also an Adjunct Associate Professor with the School of Electrical and Computer Engineering, Georgia Institute of Technology, GA, USA. His current research interests include signal and power integrity of digital systems, multiport measurement and calibration techniques, and development of electromagnetic simulation methods for communication electronics.
Dr. Schuster was the recipient of IEEE Transactions on Electromagnetic Compatibility Best Paper Awards in 2001 and 2015, Transactions on Components, Packaging and Manufacturing Technology Best Paper Awards in 2012 and 2016, IEC DesignCon Paper Awards in 2005, 2006, 2010, 2017, and 2018, three IBM Research Division Awards from 2003 to 2005, IBM Faculty Awards in 2009 and 2010, and the Sustained Service to the EMC Society Award in 2019. He is a Member of the German Physical Society (DPG) and several technical program committees of international conferences on signal and power integrity, and electromagnetic compatibility. He was Distinguished Lecturer for IEEE EMC Society from 2012–2013, as the Chair of the German IEEE EMC Chapter from 2016–2019, and as a Member of the Board of Directors of the EMC Society in 2015 and from 2020–2022. He is currently an Associate Editor for IEEE Transactions on Electromagnetic Compatibility.
研究兴趣
论文共 218 篇作者统计合作学者相似作者
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2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024 (2024)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY (2024)
IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY (2024)
2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024 (2024)
2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024 (2024)
IEEE Electromagnetic Compatibility Magazineno. 2 (2024): 54-65
2024 International Symposium on Electromagnetic Compatibility – EMC Europepp.584-589, (2024)
2024 International Symposium on Electromagnetic Compatibility – EMC Europepp.985-990, (2024)
2024 IEEE 28TH WORKSHOP ON SIGNAL AND POWER INTEGRITY, SPI 2024 (2024)
2024 IEEE MTT-S INTERNATIONAL MICROWAVE BIOMEDICAL CONFERENCE, IMBIOC 2024pp.152-154, (2024)
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作者统计
#Papers: 219
#Citation: 2258
H-Index: 24
G-Index: 39
Sociability: 6
Diversity: 1
Activity: 2
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