基本信息
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个人简介
Alper Karakuzulu (Member, IEEE) received the B.Sc. degree in electronic engineering from Atilim University, Ankara, Turkey, in 2009, and the M.Sc. degree in system-on-chip design from the Royal Institute of Technology (KTH), Stockholm, Sweden, in 2012.
He was with Revolution Semiconductor, Ankara, where he was involved in the design of Analog and RFICs for RFID chips. From 2015 to 2017, he was with Mikro Tasarim, Ankara, where he was working on the design of radar component ICs. Since 2017, he has been a Research Scientist with the Circuit Department, IHP, Frankfurt (Oder), Germany. His current research interests include RF, microwave, and millimeter-wave circuits for wireless communication and phased array applications, especially for 6G in D-band.
研究兴趣
论文共 11 篇作者统计合作学者相似作者
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IEEE Journal of Solid-State Circuitsno. 5 (2023): 1310-1322
2023 31st Telecommunications Forum (TELFOR)pp.1-4, (2023)
IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 5 (2023): 1310-1322
Thomas Zimmer,Josef Boeck,Fred Buchali,Pascal Chevalier,Michael Collisi,Bjorn Debaillie,Marina Deng,Philippe Ferrari,Sebastien Fregonese,Christophe Gaquiere,Haitham Ghanem,Horst Hettrich,Alper Karakuzulu,Tim Maiwald,Marc Margalef-Rovira,Caroline Maye,Michael Moeller,Anindya Mukherjee,Holger Ruecker,Paulius Sakalas,Rolf Schmid,Karina Schneider,Karsten Schuh,Wolfgang Templ,Akshay Visweswaran,Thomas Zwick
IEEE journal of microwavesno. 1 (2021): 288-298
IEEE Solid-State Circuits Letters (2021): 40-43
2021 29th Telecommunications Forum (TELFOR)pp.1-4, (2021)
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作者统计
#Papers: 11
#Citation: 110
H-Index: 6
G-Index: 7
Sociability: 3
Diversity: 1
Activity: 3
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