基本信息
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职业迁徙
个人简介
Wang's research interests center on RF/AMX Integrated Circuits (IC) and System-on-a-Chip (SoC), Integrated Design-for-Reliability (DfR) for ICs and Systems, 3D Heterogeneous Integration (HI) of Technologies, Devices and Circuits, IC CAD and Modeling, Emerging Nano Devices and Circuits, and LED-based Visible Light Communications (VLC) and Positioning (VLP). His research has been sponsored by the National Science Foundation (NSF) and the global microelectronics industries.
Wang's teaching interests cover microelectronics and ICs. He prefers to prepare students with industry-ready skills by challenging them with application-oriented problems and familiarizing them with industrial design methodology and tools.
Wang's academic credits include two books, 320+ peer-reviewed papers and 16 U.S. patents. Wang is recipient of IEEE J. J. Ebers Award (2022). His other awards and honors include IEEE Electron Devices Society Distinguished Service Award (2019), the CAREER Award from the National Science Foundation, the Sigma Xi Award for Excellence in University Research, Chancellor’s Award for Excellence in Undergraduate Research (UCR), J. William Fulbright Specialists roaster, and Best Student Paper Award of IEEE Radio-Frequency Integrated Circuits Symposium (RFIC). His editorial services include IEEE Electron Device Letters (EDL), IEEE Transactions on Circuits and Systems I (TCAS-I), IEEE Transactions on Circuits and Systems II (TCAS-II), IEEE Transactions on Electron Devices (TED), IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Journal of Electron Device Society (J-EDS), IET Journal of Engineering, and Power Electronic Devices and Components (PEDC). He has been IEEE Distinguished Lecturer for IEEE Solid-State Circuits Society (SSCS), IEEE Circuits and Systems Society (CAS) and IEEE Electron Devices Society (EDS). Wang served as Sr. Past President (2018-2019), Jr. Past President (2016-2017) and President (2014-2015) for IEEE Electron Devices Society. His other major professional services include IEEE Fellow Committee, IEEE CAS Analog Signal Processing Technical Committee (ASPTC/Chair), IEEE EDS VLSI Technology and Circuits Committee, SIA International Technology Roadmap for Semiconductor Committee (ITRS), IEEE 5G Initiative Committee, IEEE Heterogeneous Integration Roadmap (HIR), IEEE Smart Lighting Project, and IEEE Future Directions, etc. Wang was General Chair (2016) and TPC Chair (2015) for IEEE Radio-Frequency Integrated Circuits Symposium (RFIC), and General Chair (2021) for IEEE Electron Devices Technology and Manufacturing Conference (EDTM). He has served for many IEEE conferences as Program co-Chair, Organization co-Chair, Steering Committee Member, TPC Member, Subcommittee Chair and Session Chair, e.g., IEDM, EDTM, BCTM, ASICON, IEDST, ICSICT, CICC, RFIC, APC-CAS, ASP-DAC, ISCAS, IPFA, ICEMAC, NewCAS, ISTC, IRPS, AP-RASC, MAPE, EDSSC, MIEL, etc. He was a Program Director at National Science Foundation (2019-2021, on leaving from UCR). He speaks frequently at various industrial/academic/international forums and a frequent consultant to the IC industry. Wang is a Fellow of the National Academy of Inventors (NAI), an IEEE Fellow and an AAAS Fellow.
Wang's teaching interests cover microelectronics and ICs. He prefers to prepare students with industry-ready skills by challenging them with application-oriented problems and familiarizing them with industrial design methodology and tools.
Wang's academic credits include two books, 320+ peer-reviewed papers and 16 U.S. patents. Wang is recipient of IEEE J. J. Ebers Award (2022). His other awards and honors include IEEE Electron Devices Society Distinguished Service Award (2019), the CAREER Award from the National Science Foundation, the Sigma Xi Award for Excellence in University Research, Chancellor’s Award for Excellence in Undergraduate Research (UCR), J. William Fulbright Specialists roaster, and Best Student Paper Award of IEEE Radio-Frequency Integrated Circuits Symposium (RFIC). His editorial services include IEEE Electron Device Letters (EDL), IEEE Transactions on Circuits and Systems I (TCAS-I), IEEE Transactions on Circuits and Systems II (TCAS-II), IEEE Transactions on Electron Devices (TED), IEEE Journal of Solid-State Circuits (JSSC), IEEE Transactions on Device and Materials Reliability (TDMR), IEEE Journal of Electron Device Society (J-EDS), IET Journal of Engineering, and Power Electronic Devices and Components (PEDC). He has been IEEE Distinguished Lecturer for IEEE Solid-State Circuits Society (SSCS), IEEE Circuits and Systems Society (CAS) and IEEE Electron Devices Society (EDS). Wang served as Sr. Past President (2018-2019), Jr. Past President (2016-2017) and President (2014-2015) for IEEE Electron Devices Society. His other major professional services include IEEE Fellow Committee, IEEE CAS Analog Signal Processing Technical Committee (ASPTC/Chair), IEEE EDS VLSI Technology and Circuits Committee, SIA International Technology Roadmap for Semiconductor Committee (ITRS), IEEE 5G Initiative Committee, IEEE Heterogeneous Integration Roadmap (HIR), IEEE Smart Lighting Project, and IEEE Future Directions, etc. Wang was General Chair (2016) and TPC Chair (2015) for IEEE Radio-Frequency Integrated Circuits Symposium (RFIC), and General Chair (2021) for IEEE Electron Devices Technology and Manufacturing Conference (EDTM). He has served for many IEEE conferences as Program co-Chair, Organization co-Chair, Steering Committee Member, TPC Member, Subcommittee Chair and Session Chair, e.g., IEDM, EDTM, BCTM, ASICON, IEDST, ICSICT, CICC, RFIC, APC-CAS, ASP-DAC, ISCAS, IPFA, ICEMAC, NewCAS, ISTC, IRPS, AP-RASC, MAPE, EDSSC, MIEL, etc. He was a Program Director at National Science Foundation (2019-2021, on leaving from UCR). He speaks frequently at various industrial/academic/international forums and a frequent consultant to the IC industry. Wang is a Fellow of the National Academy of Inventors (NAI), an IEEE Fellow and an AAAS Fellow.
研究兴趣
论文共 251 篇作者统计合作学者相似作者
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IEEE Electron Devices Reviewsno. 99 (2024): 1-15
2024 IEEE 42ND VLSI TEST SYMPOSIUM, VTS 2024 (2024)
Electronicsno. 12 (2024): 2341-2341
APPLIED PHYSICS REVIEWSno. 2 (2024)
IEEE Transactions on Materials for Electron Devicesno. 99 (2024): 1-15
2023 IEEE International Conference on Smart Internet of Things (SmartIoT) (2023)
2023 IEEE Asian Solid-State Circuits Conference (A-SSCC) (2023)
IEEE journal of the Electron Devices Society (2023): 700-707
2023 IEEE 15th International Conference on ASIC (ASICON)pp.1-2, (2023)
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作者统计
#Papers: 251
#Citation: 2144
H-Index: 25
G-Index: 34
Sociability: 6
Diversity: 1
Activity: 2
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