基本信息
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职业迁徙
个人简介
Research focus - Copper sintering for microelectronics packaging
研究兴趣
论文共 51 篇作者统计合作学者相似作者
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NEW JOURNAL OF CHEMISTRYno. 15 (2024): 6796-6808
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-6, (2024)
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1219-1224, (2024)
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)pp.1-5, (2023)
Sri Krishna Bhogaraju,Nihesh Mohan, Fabian Steinberger,Hueseyin Erdogan, Philipp Hadrava,Gordon Elger
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-6, (2023)
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-6, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-5, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-5, (2023)
2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC)pp.1-7, (2023)
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作者统计
#Papers: 51
#Citation: 205
H-Index: 9
G-Index: 13
Sociability: 4
Diversity: 0
Activity: 2
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