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Bio
霍博士长期致力于碳化硅新型功率电子器件、VECSEL高功率激光芯片工艺制造及封装技术研究工作,在低温无损异质集成技术领域具有较高学术造诣,所发明的超薄银铟瞬态液相技术是最新一代碳化硅新型功率电子器件与VECSEL高功率激光芯片制造封装关键性技术。曾研究并发现银基合金所存在的固溶软化与孪晶塑性变形机制,综合密度泛函理论(DFT)与Lewis强弱酸碱理论(HSAB), 发现并解释了银铟合金所具备的优异抗硫化特性。近5年在高水平SCI期刊上发表学术论文10篇。
研究领域:
1. 高功率光电子器件封装;
2. 异质材料集成工艺;
3. 低温瞬态液相微纳互联;
4. 高分辨透射电镜材料表征;
Research Interests
Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts
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MATERIALS CHARACTERIZATION (2024): 113793
MATERIALSno. 7 (2024)
MATERIALS TODAY COMMUNICATIONS (2024): 108155
Shizun Hu,Jiaqi Song, Yu Liu, Chenran Wu, Tianhao Lei, Anxu Ge,Donglin Zhang,Xiuchen Zhao,Yongjun Huo,Chin C. Lee
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGYno. 2 (2024): 328-341
Materials (Basel, Switzerland)no. 7 (2024)
Materialsno. 7 (2024): 1658
Materialsno. 7 (2024)
2023 24th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2023)
ACS PHOTONICSno. 3 (2023): 673-682
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