Gerald Strevig

Gerald Strevig IBM Corporation, Austin, TX 78758 USA (strevig@us.ibm.com). Mr. Strevig received a B.S. degree in electrical engineering from the University of Texas at Austin, Austin, TX, USA. He is currently a Senior Engineer with IBM Systems, Austin. Since joining IBM in 2002, he has been working on several IBM POWER and Z systems focusing on the area of nest and chip physical design integration. After one year away with Qualcomm, in 2015, he returned to IBM, where he has focused on IBM POWER and Z chip and core physical design and methodology. He is the author or coauthor of six filed patents. He is a recipient of an IBM Corporate Award for his contribution to IBM z15 physical design methodology and two IBM Outstanding Technical Achievement Awards for POWER and IBM Z chip physical design integration.