Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling

Idowu Olatunji,Abhishek Deshpande,Manuel Bascolo,Abhijit Dasgupta,Ulrich Becker,Gabor Jokai

2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)（2022）

引用 1|浏览6

暂无评分

摘要

This paper reports preliminary finite element analysis (FEA) simulations conducted to support a study on durability risk in BGA assemblies due to sequential combination of temperature cycling (TC) and harmonic vibration loading. Experimental results, presented in a companion paper, showed that the resulting damage modes are a combination of two damage modes: (i) solder-IMC interfacial fracture and...

查看译文

关键词

Finite element analysis,Copper Trace,SAC305 Solder,Harmonic Vibration,Thermal cycling,Combined loading,Fatigue

AI 理解论文

溯源树

样例

生成溯源树，研究论文发展脉络

Chat Paper

正在生成论文摘要