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Abhijit Dasgupta conducts his research on the mechanics of engineered, heterogeneous, active materials, with special emphasis on the micromechanics of constitutive and damage behavior. He applies his expertise to several multifunctional material systems. His research contributions include solution techniques for coupled boundary value problems in multifunctional particulate and laminated composites, micromechanics approaches for constitutive properties of advanced 3-D composites, dynamic behavior and failure of thick composites, micromechanics of fatigue damage in viscoplastic eutectic-alloy composites and in short-fiber polymeric composites, and self-health monitoring in “smart” systems. He applies these principles for developing effective virtual qualification tools, for optimizing manufacturing process windows, for real-time health monitoring and for devising quantitative accelerated testing strategies used in qualification and quality assurance of complex electronic, electromechanical and structural systems. He has published over 150 journal articles and conference papers on these topics, presented over 20 short workshops nationally and internationally, served on the editorial boards of three different international journals, organized several national and international conferences, and received six awards for his contributions in materials engineering research and education.
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2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-6, (2024)
Aniket Bharamgonda, Idowu Olatunji,Xiao Lin,Abhijit Dasgupta,Yaxiong Chen,Varun Thukral,Torsten Hauck
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2024)
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-5, (2023)
Beihan Zhao,Aniket Bharamgonda, Edwin Quinn, George Stackhouse,Jason Fleischer,Michael Osterman,Michael H. Azarian,Daniel R. Hines,Siddhartha Das,Abhijit Dasgupta
JOURNAL OF ELECTRONIC PACKAGINGno. 4 (2023)
ACS APPLIED NANO MATERIALSno. 2 (2023): 1459-1474
biorxiv(2023)
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Nanotechnologyno. 36 (2023): 365705-365705
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2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-4, (2023)
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JOURNAL OF ELECTRONIC PACKAGINGno. 4 (2023)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-5, (2022)
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