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个人简介
Tingyu Lin received the Ph.D. degree in microelectronics from the National University of Singapore (NUS), Singapore, in 1997.
He has more than 20-year experiences in design, process, assembly, reliability, and equipment development in electronics packaging. He was a Motorola (Google) certified Six Sigma Black Belt in 2012. Since 2013, he has been the Technical Director of the National Center for Advanced Packaging (NCAP), Wuxi, China. Until now, he has been engaged in more than 100 product design and process development in mobile module, IC component, and consumer electronics. He has published 150 articles and filed more than 80 patents.
Dr. Lin received many excellent paper awards and gave keynote talks in several conferences. He led two international ASTM sputtering material standards (F3166/F3192) for TSV development and received the Motorola Innovation Award in 2008.
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