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论文共 34 篇作者统计合作学者相似作者
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Ravi Mahajan,Xiaoqian Li, Joshua Fryman,Zhichao Zhang,Srikant Nekkanty,Pooya Tadayon,James Jaussi,Sergey Shumarayev,Ankur Agrawal, Susheel Jadhav,Kumar Abhishek Singh,Andrew Alduino,
Kaveh Hosseini,Edwin Kok,Sergey Y. Shumarayev,Chia-Pin Chiu,Arnab Sarkar,Asako Toda, Yanjing Ke,Allen Chan,Daniel Jeong,Mason Zhang, Sangeeta Raman,Thungoc Tran,
2021 OPTICAL FIBER COMMUNICATIONS CONFERENCE AND EXPOSITION (OFC)pp.1-3, (2021)
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Je-Young Chang,Devdatta Kulkarni,Ravi Mahajan,Michael Jorgensen, Nick Neal, Rich Dischler,Aravind Dasu,Sandeep Ahuja, Rajiv Mongia
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.18-23, (2021)
Mark T. Wade,Roy Meade, Chandru Ramamurthy,Michael Rust, Forrest Sedgwick,Vladimir Stojanovic,Derek Van Orden,Chong Zhang,Chen Sun,Sergey Y. Shumarayev, Conor O'Keeffe,Erik Anderson,
Ravi Mahajan,Robert Sankman,Kemal Aygun,Zhiguo Qian,Ashish Dhall, Jonathan Rosch,Debendra Mallik,Islam Salama
Advances in Embedded and Fan-Out Wafer-Level Packaging Technologiespp.487-499, (2019)
Raja Swaminathan,Ram Viswanath,Ravi Mahajan,Kaladhar Radhakrishnan,Kemal Aygun, Scott Mokler, Babak Sabi
IEEE Transactions on Components, Packaging and Manufacturing Technologyno. 10 (2019): 1952-1962
IEEE Transactions on Components, Packaging and Manufacturing Technologypp.1-1, (2019)
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