基本信息
浏览量:0
职业迁徙
个人简介
Nilanjan Pal (Member, IEEE) received the B.Tech. and M.Tech. degrees in electronics and electrical communications engineering from IIT Kharagpur, Kharagpur, India, both in 2015. He is currently pursuing the Ph.D. degree with the University of Illinois at Urbana-Champaign, Urbana, IL, USA.
From 2015 to 2017, he was an Analog Design Engineer with Analog Devices, Inc., Bengaluru, India, where he was involved in designing low-dropout regulators (LDOs), temperature-compensated ring oscillators, and very low current measurement modules. In 2013, he received DAAD Scholarship to perform a Research Internship with RWTH Aachen University, Aachen, Germany. He was an Intern with Texas Instruments, Phoenix, AZ, USA, where he worked on high-efficiency dc–dc converters. He is currently a Research Assistant with the University of Illinois at Urbana-Champaign. His current research interests include developing techniques for building high-efficiency power converters and temperature-compensated oscillators.
研究兴趣
论文共 15 篇作者统计合作学者相似作者
按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
IEEE Journal of Solid-State Circuitsno. 7 (2023): 2064-2074
引用1浏览0EIWOS引用
1
0
IEEE Journal of Solid-State Circuitsno. 12 (2023): 3459-3469
ISSCCpp.62-63, (2023)
IEEE Journal of Solid-state Circuitsno. 7 (2023): 2064-2074
IEEE JOURNAL OF SOLID-STATE CIRCUITSno. 3 (2022): 785-795
IEEE JOURNAL OF SOLID-STATE CIRCUITSpp.1-11, (2022)
2022 IEEE Custom Integrated Circuits Conference (CICC)pp.1-2, (2022)
加载更多
作者统计
合作学者
合作机构
D-Core
- 合作者
- 学生
- 导师
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果,我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问,可以通过电子邮件方式联系我们:report@aminer.cn