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Ming Li (Senior Member, IEEE) received the M.S. and Ph.D. degrees in electrical engineering from the State University of New York at Buffalo (SUNY-Buffalo), Buffalo, NY, USA, in 2005 and 2010, respectively. From 2011 to 2013, he was a Postdoctoral Research Associate with the Signals, Communications, and Networking Research Group, Department of Electrical Engineering, SUNY-Buffalo. From 2013 to 2014, he joined Qualcomm Technologies Inc. as a Senior Engineer. Since June 2014, he has been with the School of Information and Communication Engineering, Dalian University of Technology, Dalian, China, where he is currently an Associate Professor. His research interests include communication theory and signal processing with applications to intelligent reflecting surface, mmWave communications, secure wireless communications, cognitive radios and networks.
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arxiv(2024)
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IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGYno. 3 (2024): 4471-4475
2023 International Conference on Wireless Communications and Signal Processing (WCSP)pp.1062-1066, (2023)
GLOBECOM 2023 - 2023 IEEE Global Communications Conferencepp.3118-3123, (2023)
International Conference on Communication Technologypp.434-438, (2023)
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