基本信息
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职业迁徙
个人简介
研究領域
III-V compound semiconductor heterostructures, gas-source molecular beam epitaxy (MBE), in
situ etching and patterned growth by metal-organic MBE, electronic/optoelectronic devices
榮譽獎勵
2014, IEEE Region 6 (Western US, including Hawaii) Outstanding Educator Award
2013, Honorary Doctorate, Linkoping University, Sweden
2011, MBE Innovator Award, North American Molecular Beam Conference
2009, Pan Wen-Yuan Foundation Outstanding Research Award, Taiwan
2008-2011, World Class University Professor, Dept. Nanobio Materials and Electronics,
Gwangju Institute of Science and Technology, Gwangju, Korea
2007, Distinguished Professor, University of California, San Diego
2006, Engineering Educator of the Year, San Diego County Engineering Council
2005, Asian Heritage Award on Science, Technology & Research, Asia Journal
2004, Fellow of the AVS Science and Technology Society
2002, Fellow of the American Physical Society
2002, Fellow of the Institute of Electrical and Electronics Engineers (IEEE)
1997, ranked no. 613 Most Cited Physicist, 1981-1997, by ISI (among 500,000 authors)
1997, Japan Society for Promotion of Sciences (JSPS) Fellowship
1995-2008, Adjunct Professor, Dept. Materials Science & Engineering, GIST, Korea
1993-1995, NSF-Japan Center for Global Partnership Fellowship.
1991, United Nations Development Program Award for a lecture tour in China
1987, Distinguished Member of Technical Staff, AT&T Bell Labs
1985, 1986, 1987, Exceptional Contribution Award, AT&T Bell Labs
研究兴趣
论文共 66 篇作者统计合作学者相似作者
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Chien-Wei Huang,Chun-Nien Liu, Sheng-Chuan Mao, Wan-Shao Tsai, Zingway Pei,Charles W. Tu,Wood-Hi Cheng
SENSORSno. 6 (2024): 1897
Zon, Tzu-Wei Lo, Zhen-Lun Li, Samatcha Vorathamrong,Chao-Chia Cheng,Chun-Nien Liu, Chun-Te Chiang, Li-Wei Hung, Ming-Sen Hsu,Wei-Sheng Liu,Jen-Inn Chyi,Charles W. Tu
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY Ano. 3 (2024)
Chien-Wei Huang,Chun-Nien Liu, Sheng-Chuan Mao,Yung-Peng Chang,Zingway Pei,Charles W. Tu,Wood-Hi Cheng
2023 Conference on Lasers and Electro-Optics (CLEO)pp.1-2, (2023)
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NEXT-GENERATION OPTICAL COMMUNICATION: COMPONENTS, SUB-SYSTEMS, AND SYSTEMS XI (2022)
The Handbook of Surface Imaging and Visualizationpp.433-447, (2022)
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