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The End-of-Substructure Card for the ATLAS ITk Strip Upgrade: Lessons Learned from the Full Production

M. Stanitzki, L. Bauckhage, A. L. Boebel,H. Ceslik,M. Dam, A. F. Arranca Menezes Trigueiros Da Silva,S. Diez Cornell, C. M. Garvey,P. Goettlicher, R. S. Godfredsen,I.-M. Gregor,J. M. Keaveney, A. Palmelund,S. Ruiz Daza,S. Schmitt,L. R. Strom

2024 IEEE Nuclear Science Symposium (NSS), Medical Imaging Conference (MIC) and Room Temperature Semiconductor Detector Conference (RTSD)(2024)

DESY - Deutsches Elektronen Synchrotron | Niels Bohr Institute | Department of Physics

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Abstract
The ATLAS Strip Tracker for HL-LHC consists of so-called modules that host the silicon sensors and the front-end electronics. These units are then mounted on mechanical structures, the so-called staves and petals, which are hosting up to 14 modules per side. An End-of-Substructure (EoS) card connects up to 28 data lines from the modules to and up to 12 lines from the lpGBT ASIC. The lpGBT then does (De-)Serialization and connects to the VL+ ASICs which then provides a 10 GBit/s optical data transmission to the off-detector systems respectively. The EoS is powered by a dedicated Dual-Stage DC-DC converter unit. As the both staves and petals host modules on both sides, two EoS are required for each stave and petal, however to reduce cabling, they are sharing a single voltage connector. While schematically the EoS cards are very closely related, especially for the barrel each layer requires a distinct layout, which adds complexity also for testing. As the EoS production of almost 2000 EoS cards and the accompanying 2000 DC-DC converters is going to be completed in fall 2024, we report on the production experience including detailed QC statistics. We conclude with a few lessons learned during the project duration.
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要点】:本文介绍了ATLAS Strip Tracker升级项目中的End-of-Substructure (EoS)卡的生产过程,并分享了生产经验及从中得到的教训,强调了其在高能物理实验中的关键作用。

方法】:通过设计EoS卡,将来自硅传感器模块的数据线连接至lpGBT ASIC,并实现数据的串行化和10 GBit/s的光学数据传输,同时使用双阶段DC-DC转换器为EoS供电。

实验】:完成了近2000个EoS卡和2000个DC-DC转换器的生产,并对生产过程进行了详细的质量控制统计,结果将在2024年秋季完成。