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Material Removal Characterization During Axial Ultrasonic Vibration Grinding SiCp/Al Composites with a Single Diamond Grain

Jianhao Peng,Yu Yao, Zhipeng Xu, Xuebin Yao,Biao Zhao,Wenfeng Ding

The International Journal of Advanced Manufacturing Technology(2024)

Cited 0|Views9
Key words
Ultrasonic vibration-assisted grinding,Grinding force,Material removal mechanism,SiCp/Al composites,Machined surface damage
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