Novel Low Thermal Budget Bonding Using Single Wafer Thermal Processing System, Resulting in Excellent Wafer-to-Wafer Hybrid Bonding at Sub-0.5Um Pitch
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)（2024）
关键词
DRAM,HBM,W2W,thermal annealing,hybrid bonding,heterogeneous integration,advanced packaging,recess control
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