High Power Thermal Test Vehicle with 2-Phase Cooling for AI Datacenters, 5G RAN, and EDGE Compute Nodes
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024（2024）
关键词
MCM,Multi-chip Module,two-phase cooling,OHP,Thermal Test Vehicle,TTV
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要