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Wideband Antennas on Thin-Film Packaging Substrates for 140 GHz 6G Applications

Thi Huyen Le,Michael Philipp Kaiser, Julia-Marie Koezegi,Kavin Senthil Murugesan, Lutz Gerhold, Habib Hichri, Ryohei Oishi, Reki Nakano,Ivan Ndip,Martin Schneider-Ramelow

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)(2024)

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Key words
wideband antennas,6G antennas,D-Band,thin-film,packaging substrate
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