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Strong Adhesion of Electroless Plated Copper by Optimizing Lamination Temperature of Epoxy Composite Film for Advanced Chip Packaging Substrates

Suibin Luo,Junyi Yu, Peilin Ma,Chunbo Gao,Peng Li, Chuanxi Zhu, Yiquan Yang,Pengpeng Xu, Jie Yang,Rong Sun,Shuhui Yu

Advanced Engineering Materials（2024）

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关键词
adhesion strength,build-up substrates,lamination temperature,surface roughness
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