谷歌浏览器插件
订阅小程序
在清言上使用

Influences of low In alloying and aging on microstructure and plastic deformation behavior of Sn-58Bi solder

Journal of Materials Science: Materials in Electronics(2024)

引用 0|浏览2
暂无评分
摘要
The SnBi eutectic solder shows high ductility at low strain rate, while plastic deformation of the Sn-rich phase in it is restrained due to the high content of the brittle Bi-rich phase and the fine interlocked lamellar structure, thus the impact toughness of the SnBi solder is poor. In this study, 1.5 wt
更多
查看译文
AI 理解论文
溯源树
样例
生成溯源树,研究论文发展脉络
Chat Paper
正在生成论文摘要