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Asymmetric growth of Cu6Sn5 intermetallic compound in Cu/Sn/Cu interconnection system under the vertical ultrasonic vibration

H.W. Niu,H. Bian, X. Liu,X.G. Song,H.Y. Zhao

Intermetallics（2024）

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Key words
Intermetallic compounds,TLP soldering,Ultrasonic waves,Grain morphology,Fracture path
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