Interfacial Stress and Crack Propagation Experimental Study in Mini-LED Chip Debonding

The ultra-miniaturization trend of chips presents new challenges for non-destructive peeling-off techniques. This study models the mini-LED chip-UV film adhesive system as a micro laminated structure and conducts the interfacial stresses and crack propagation analysis of the structure using theoretical, finite element and experimental methods. The innovations of this paper are the illustration of the negligible effect of size effect on 125 μm x 75 μm x 60 μm chips, and the determination of the technology parameter tuning method to promote chip peeling-off. Firstly, applying the first-order shear deformation theory, and considering the UV-curable acrylic adhesive layer and the UV film as elastic materials, Lamé coefficients are introduced to explore the free vibration of the micro laminated structure. The analyses indicate that the scale effect has an extremely small impact, within 0.5%, on natural frequencies of the 100-micron scale laminated structure with a small length-to-thickness ratio. Thereafter, a three parameter elastic foundation (3-PEF) model of the chip-UV film adhesive structure is established and the interfacial stresses distributions are parametrically analyzed. Additionally, an experimental platform for needle-ejecting chip peeling-off is designed and constructed. Finite element simulation, experimental observations, and image recognition of crack generation and propagation during the peeling process were performed. Results show that cracks are generated at both free ends of the adhesive layer and progressively extended inwards. This is consistent with the 3-PEF analytical solution, in which the stress concentration also occurs at free ends of the adhesive layer. The agreement between theoretical, simulation and experimental results regarding interfacial stresses provides a solid foundation for further analysis of chip peeling-off mechanism.