Timing Resolution Performance of Timepix4 Bump-Bonded Assemblies

The timing performance of the Timepix4 application-specific integratedcircuit (ASIC) bump-bonded to a 100 μm thick n-on-p siliconsensor is presented. A picosecond pulsed infrared laser was used to generateelectron-hole pairs in the silicon bulk in a repeatable fashion, controllingthe amount, position and time of the stimulated charge signal. The timingresolution for a single pixel has been measured to 107 ps r.m.s.for laser-stimulated signals in the silicon sensor bulk. Consideringmulti-pixel clusters, the measured timing resolution reached 33 psr.m.s. exploiting oversampling of the timing information over several pixels.