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The Impact of Post-Deposition Annealing Durations on the Formation of Tb4O7 Passivation Layer on Silicon Substrate

Ceramics International(2024)SCI 2区SCI 1区

Univ Sains Malaysia | Sule Lamido Univ Kafin Hausa

Cited 0|Views7
Abstract
In this study, we have effectively utilized radio frequency (RF) sputtering to sputter the Tb4O7 passivation layer on an n-type silicon (Si) substrate in an argon (Ar) ambient. Various characterization approaches were used to investigate the impact of varying annealing durations on structural, morphological, compositional, and optical properties. The grazing incidence X-ray diffraction (GIXRD) pattern confirmed that all investigated Tb4O7 passivation layers (as grown) and annealed at (15, 30, and 45 min) showed a crystalline structure, respectively. As observed, the sample annealed for 30 min attained the highest crystallinity, around 39.51 nm. Surface morphology analysis revealed different surface structures in response to different annealing durations when observed using the field emission scanning electron microscopy (FESEM) technique. Atomic force microscopy (AFM) was utilized to investigate the top surface of the examined samples, and a higher surface roughness of around 2.37 nm was obtained for the sample annealed for 30 min. The band gap energies (Eg) were estimated by applying the Kubelka-Munk (KM) approach for all the investigated samples, and the obtained values were within a range between (1.94-3.07 eV) earlier reported in the literature. Previous studies have shown that the Tb4O7 passivation layer deposited onto Si substrates using RF sputtering and then annealed for 5 min at 900 degrees C in an Ar atmosphere, resulted in the formation of a highly crystalline passivation layer. However, there is a lack of a clear explanation for the observation, and the authors mainly concentrated on the electrical properties of the Tb4O7 material. This inspired us to carry out this study to investigate the impact of various annealing durations on the formation of Tb4O7 passivation layers, focusing on their structure, composition, morphology, and optical properties.
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RF sputtering power,Silicon substrate,Annealing time,Argon ambient
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要点】:本文研究了不同退火时间对在硅基底上形成的Tb4O7钝化层的结构、组成、形貌和光学性质的影响,发现退火30分钟时钝化层的结晶性和表面粗糙度最佳。

方法】:采用射频溅射技术在氩气环境下将Tb4O7钝化层溅射到n型硅基底上,并通过多种表征手段分析不同退火时间对钝化层的影响。

实验】:通过 grazing incidence X-ray diffraction (GIXRD)、场发射扫描电子显微镜(FESEM)、原子力显微镜(AFM)等技术研究了退火时间为15、30和45分钟的Tb4O7钝化层,数据集名称未提及,但实验结果显示退火30分钟的样品结晶性最高,表面粗糙度约为2.37 nm。