The laser cavity electric connection line with SnAg solder for laser flip chip bonding
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
关键词
Electric Lines,Flip-chip,Spin-coated,Diode Laser,Sidewall,Passivation Layer,Photonic Integrated Circuits,Step Height,Cavity Height,Optical Tomography,Schematic Diagram,Series Resistance,Coupling Efficiency,Optical Microscopy Images,Dry Etching,Silicon Photonics,Small Form Factor,Alignment Marks
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