Optimization of the CMP Process for Direct Wafer-to-wafer Oxide Bonding

Hong-Miao Ji,Hemanth Kumar Cheemalamarri,Ting-Ta Chi, Hui-ting Lim Serene, Wei-Jie Teo Dickson, Siang-Kiat Neo Alfred,Hong-Yu Li, Gim-Guan Chen Jon,Nandini Venkataraman,Wen Lee

2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）

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Chemical Mechanical Polishing,Chemical Mechanical Polishing Process,Flat Surface,Surface Topography,Interfacial Bond,Packaging Technology,Minimal Defects,Back-end-of-line,Grayscale,Surface Density,Oxide Thickness,Oxidative Removal,Sparse Areas,Non-uniform Density

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