Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
关键词
Signal Transmission,Air Bubbles,Signal Loss,Acoustic Signals,Presence Of Voids,Sound Transmission,Heterogeneous Integration,Use Of Various Methods,Minimal Loss,Shear Strength,Electron Beam Evaporation,Shear Test,Echo Signal,Void Formation,Plasma Cleaner
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要