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Cooling Future System-on-chips with Diamond Inter-Tiers

Mohamadali Malakoutian,Anna Kasperovich,Dennis Rich,Kelly Woo,Christopher Perez,Rohith Soman, Devansh Saraswat,Jeong-kyu Kim,Maliha Noshin,Michelle Chen,Sam Vaziri,Xinyu Bao, Che Chi Shih,Wei-Yen Woon,Mehdi Asheghi,Kenneth E. Goodson,Szuya Sandy Liao,Subhasish Mitra,Srabanti Chowdhury

Cell Reports Physical Science（2023）

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关键词
thermal management,diamond,in-plane thermal conductivity,2D-3D SoC,diamond inter-tiers,BEoL compatible
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