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Prevention of Cu Electrolytic Migration Defects on RDL by a Cu-Selective Passivation to Enhance Reliability

Ashish S. Salunke,John Alptekin, Kaushik Akula, Subiksha Jayakumar, Shaurya Kumar,Oliver Chyan

Journal of Microelectronics and Electronic Packaging（2023）

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Electrical Resistivity
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