Preparation and Characterization of Sn-3.0Ag-0.5Cu Nano-Solder Paste and Assessment of the Reliability of Joints Fabricated by Microwave Hybrid Heating

Shuai Zhang,Shuye Zhang,Hongzhi Zhou,Kyung-Wook Paik,Tianran Ding,Weimin Long,Sujuan Zhong,Peng He

MATERIALS CHARACTERIZATION（2024）

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关键词
Sn-3.0Ag-0.5Cu nano -solder paste,Microwave hybrid heating,Exposure time,Reliability assessment
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