Process Integration of Photonic Interposer for Chiplet-based 3D Systems
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
关键词
Photonics,Interposer,silicon ring modulator,TSV Mid,Optical Network on Chip,High Performance Computing,Chiplet
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要