Surface Modification on Hydrophilicity Enhancement Using NH4OH, NaOH, and KOH on Fine-Pitch Low-Temperature Cu/SiO2 Hybrid Bonding
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）
Key words
Heterogeneous Integration,low-temperature Cu/SiO2 hybrid bonding,surface modification,interfacial analysis
AI Read Science
Must-Reading Tree
Example
Generate MRT to find the research sequence of this paper
Chat Paper
Summary is being generated by the instructions you defined