SPICE Modeling in Verilog-A for Photo-Response in UTC-Photodiodes Targeting Beyond-5G Circuit Design
IEEE transactions on computer-aided design of integrated circuits and systems（2023）
关键词
Integrated circuit modeling,Mathematical models,Photoconductivity,Analytical models,Computational modeling,Indium phosphide,III-V semiconductor materials,Beyond-5G circuit design,photodiode compact model,SPICE,uni-traveling carrier (UTC) photodiode (PD),Verilog-A
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