In situ study of electrochemical migration of Sn3Ag0.5Cu solder reinforced by Cu 6 Sn 5 nanoparticles

Ziwen Lv,Jintao Wang,Fengyi Wang,Weiwei Zhang,Jianqiang Wang,Fuquan Li,Hongtao Chen

Journal of Materials Science: Materials in Electronics（2023）

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关键词
cu6sn5 nanoparticles,electrochemical migration
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