Curvature Measurements to Improve Polymer Integration in Microelectronic Devices
2023 34th Annual SEMI Advanced Semiconductor Manufacturing Conference (ASMC)（2023）
关键词
Thermally induced curvature,polymer,coefficient of thermal expansion,Young’s modulus,Poisson’s ratio,glass transition,thermal stress,bilayer,characterization techniques,glassy state,rubbery state,ellipsometry,picosecond ultrasonics
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