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Subtractive Ru Interconnect Enabled by Novel Patterning Solution for EUV Double Patterning and TopVia with Embedded Airgap Integration for Post Cu Interconnect Scaling

C. Penny,K. Motoyama, S. Ghosh,T. Bae,N. Lanzillo,S. Sieg,C. Park, L. Zou, H. Lee,D. Metzler, J. Lee, S. Cho, M. Shoudy,S. Nguyen,A. Simon, K. Park,L. Clevenger,B. Anderson,C. Child,T. Yamashita, J. Arnold, T. Wu, T. Spooner,K. Choi,K-I. Seo,D. Guo

2022 International Electron Devices Meeting (IEDM)（2022）

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Key words
subtractive ru interconnect,post cu interconnect scaling,euv double patterning,embedded airgap integration,novel patterning solution
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